​​Best Paper Awards:

• Best Paper Award in 2019 IEEE 10th Annual Ubiquitous Computing, Electronics & Mobile Communication Conference (UEMCON), New York City, NY, USA - Paper Title: Performance Analysis of Squarely Packed Polymorphic SWCNT Interconnect.​​

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Fellowship Awards:

• Dean's fellowship from the College of Engineering at University of Massachusetts Amherst (UMass) for spring semester 2022.​

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Travel Awards:

• Travel grant funding of $1000 to attend EMBC2023 in Australia from the College of Engineering at University of Massachusetts Amherst (UMass) for spring semester 2023.

• Travel Award of $500 to attend the ROCKY MOUNTAIN MUSCLE SYMPOSIUM PRE-CONFERENCE SUMMIT 

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